Dear all,

I'm wondering if there is a general consensus when it comes to selecting a
laminate material for PCBs for Lead Free. Is the standard FR4 Tg 130C
adequate for Lead Free or would we need to move towards a higher grade
>Tg170.

I'm a little confused in that some say it is required to move to the higher
Tg to accomodate for the higher Assembly temperature while others say Tg
170C is unnecessary. Are people moving towards to the higher Tg as an
assurance or is it a requirement for the higher processing temperature?


Kind Regards
Dennis Bang


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