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| Reply To: | (Leadfree Electronics Assembly Forum) |
| Date: | Thu, 17 Mar 2005 11:13:32 -0700 |
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Dr. Chen,
Thank you for your kind offer to provide an e-copy of this paper. I will certainly wish a copy.
Please send it to me by simply replying to this email.
Best regards,
Ron Pickard
Regulatory Compliance Manager
Hypercom Corp.
2851 West Kathleen Rd.
Phoenix, AZ 85023 USA
email: [log in to unmask]
tel: +602-504-4966; fax: +602-504-4711
web: www.hypercom.com
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Subject
Please respond to [LF] tin whiskers on Sn-Mn alloy electrodeposits
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Dear all,
Another paper on the growth of tin whiskers:
Observations of the Spontaneous Growth of Tin Whiskers on Tin-Manganese
Alloy Electrodeposits, Phys. Rev. Lett. 94, 066104 (2005)
We are primarily concerned with the corrosion resistance of Sn-Mn alloy
electrodeposits, but it was found that this alloy suffered from rapid and
severe formation of tin whiskers during storage. If you don't have access to
this journal, ask me for one e-copy.
Regards,
Dr. Keming Chen
IPTME
Loughborough University
Loughborough
Leics. LE11 3TU
UK
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