Hi Camille, Chris, Colin, IPC LF Listservers,
 (Gee 3 C's)

Camille, do you have any idea or memory of what this .063 limitation was
all about? and for what process? I can guess that they were talking about
going near or above Tg, with laminate that isn't designed for LF, or
laminate being used on a product whose reliability doesn't matter. Where
they talking about Wave Solder with SnCu or Wave Solder in general needing
supports going across the wave?

Colin, I expect that some very large telecon planars will be going lead
free so I don't see that size of the PCB will be any factor. Basically I
agree with Dolby-Chris

Yours in Engineering, Dave
Y i Engr, MA/NY DDave

<Colin,
<
A seminar I went to last year said that for 0.063-inch
thick PCBs, the PCB will need a metal frame for
support if it is greater than 9 inches in any dimension.
<
<-Camille

--- "James, Chris" <[log in to unmask]> wrote:

> We still expect equipment capability to be the
> limiting factor on board
> size.
>
> You may need to look a board supports to stop sag.

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