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Subject:	tin whiskers on Sn-Mn alloy electrodeposits
From:	Keming Chen <[log in to unmask]>
Reply To:	(Leadfree Electronics Assembly Forum)
Date:	Thu, 17 Mar 2005 17:20:30 -0000
Content-Type:	text/plain
Parts/Attachments:	text/plain (29 lines)

Dear all,

Another paper on the growth of tin whiskers:

Observations of the Spontaneous Growth of Tin Whiskers on Tin-Manganese
Alloy Electrodeposits, Phys. Rev. Lett. 94, 066104 (2005)

We are primarily concerned with the corrosion resistance of Sn-Mn alloy
electrodeposits, but it was found that this alloy suffered from rapid and
severe formation of tin whiskers during storage. If you don't have access to
this journal, ask me for one e-copy.

Regards,

Dr. Keming Chen
IPTME
Loughborough University
Loughborough
Leics. LE11 3TU
UK

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