-----Original Message-----
From: Richard Kubin [mailto:[log in to unmask]]
Sent: Thursday, March 17, 2005 11:42 AM
To: Fern Abrams
Subject: RE: [LF] Compliance by Exemption
Folks: this issue is being addressed within the Materials Declaration
project at iNEMI, the results of which are now moving into IPC under
committee 2-18, IPC-1752.
What we are proposing is the following enumerated list for exemptions.
These include the exemptions reportedly approved at the Dec. EU TAC
committee and reported by the UK DTI. These will be listed and
referenced in the standard form that we are developing for declarations.
We agree with Kay that there may be confusion with the numbers and
versions- once we agree, we would like to propose a consistent numbering
scheme to the EU TAC.
Let me know if you have any questions.
Regards, Richard Kubin.
Exemptions: The part on this form meets the specifications listed under
General Compliance for RoHS, as applicable, except for the following
application specific exemptions. Please enter the appropriate exemptions
for the listed subpart and substance on Section V. of this form.
Section IV. RoHS Exemptions
1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp 2.
Mercury in straight flourescent lamps for general purposes not exceeding
a.) halophosphate 10mg, b.)triphosphate with normal lifetime 5 mg, c.)
triphosphate with long lifetime 8 mg 3. Mercury in straight flourescent
lamps for special purposes 4. Mercury in other lamps not specifically
mentioned in this list 5. Lead in glass of cathode ray tubes, electronic
components and flourescent tubes 6. Lead as an alloying element in steel
containing up to 0.35% lead by weight 7. Lead as an alloying element in
aluminum containing up to 0.4% lead by weight 8. Lead as an alloying
element in copper containing up to 4% lead by weight 9. Lead in high
melting temperature type solders (i.e. lead based solder alloys
containing 85 % by weight or more lead) 10. Lead in solders for servers,
storage and storage array systems, network infrastructure equipment for
switching, signalling, transmission as well as network management for
telecommunications 11. Lead in electronic ceramic parts (e.g.
piezoelectronic devices) 12. Cadmium and its compounds in electrical
contacts and cadmium plating except for applications banned under
Directive 91/338/EEC amending Directive 76/769/EEC relating to
restrictions on the marketing and use of certain dangerous substances
and preparations piezoelectronic
devices)
13. Hexavalent chromium as an anti-corrosion of the carbon steel cooling
system in absorption refrigerators 14. Lead used in compliant pin
connector systems 15. Lead as a coating material for a thermal
conduction module c-ring 16. Lead in optical and filter glass 17.
Cadmium in optical and filter glass 18. Lead in solders consisting of
more than two elements for the connection between the pins and the
package of microprocessors with a lead content of more than 80% and less
than 85% by weight 19. Lead in solders to complete a viable electrical
connection between semiconductor die and carrier within integrated
circuit Flip Chip packages
-----Original Message-----
From: Fern Abrams [mailto:[log in to unmask]]
Sent: Thursday, March 17, 2005 7:48 AM
To: Richard Kubin
Subject: FW: [LF] Compliance by Exemption
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Kay Nimmo
Sent: Thursday, March 17, 2005 3:51 AM
To: [log in to unmask]
Subject: Re: [LF] Compliance by Exemption
Unfortunately the exemption numbers might not stay the same -
particularly no.10 which in the new draft refers to compliant pin
connectors......possibly you need to add another letter which identifies
the exemption number in a particular version of the exemption annex??
Kay
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Cliff Knudson
Sent: 17 March 2005 02:09
To: [log in to unmask]
Subject: Re: [LF] Compliance by Exemption
Hi Roland,
We are tracking by exemption as some exemptions may expire at different
times. It is important for the suppliers to communicate what exemption
they are claiming to ensure we are all in agreement. The logic is we can
continue to add as exemptions increase and we tell simply by looking at
the number which exemption Exactly the supplier is claiming. Here is an
example of what we are using;
Exemption Status Indicator Flag
1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.
E1.1 2. Mercury in straight fluorescent lamps for general purposes not
exceeding:
- halophosphate 10 mg E2.1
- triphosphate with normal lifetime 5 mg E2.2
- triphosphate with long lifetime 8 mg. E2.3 3. Mercury in straight
fluorescent lamps for special purposes. E3.1 4. Mercury in other lamps
not specifically mentioned in this Annex. E4.1 5. Lead in glass of
cathode ray tubes, electronic components and
fluorescent tubes. E5.1
6. Lead as an alloying element in steel containing up to 0,35 % lead by
weight, aluminium containing up to 0,4 % leadby weight and as a copper
alloy containing up to 4 % lead by weight. E6.1
7. - Lead in high melting temperature type solders (i.e. tin-lead solder
alloys containing more than 85 % lead), E7.1
- lead in solders for servers, storage and storage array systems
(exemption granted until 2010), E7.2
- lead in solders for network infrastructure equipment for switching,
signalling, transmission as well as network management for
telecommunication, E7.3
- lead in electronic ceramic parts (e.g. piezoelectronic devices). E7.4
8. Cadmium plating except for applications banned under Directive
91/338/EEC (1) amending Directive 76/769/EEC (2) relating to
restrictions on the marketing and use of certain dangerous substances
and preparations. E8.1
9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling
system in absorption refrigerators. E9.1
10. Within the procedure referred to in Article 7(2), the Commission
shall evaluate the applications for:
- Deca BDE, E10.1
- mercury in straight fluorescent lamps for special purposes, E10.2
- lead in solders for servers, storage and storage array systems,
network infrastructure equipment for switching, signalling, transmission
as well as network management for telecommunications (with a view to
setting a specific time limit for this exemption), and E10.3
- light bulbs, as a matter of priority in order to establish as soon as
possible whether these items are to be amended accordingly. E10.4
Take care,
Cliff
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of ext Roland Ducote
Sent: Wednesday, March 16, 2005 3:02 PM
To: [log in to unmask]
Subject: [LF] Compliance by Exemption
Hello All,
There has been alot of discussion concerning current exemptions and the
possiblity of future exemptions on board level components. For example
the exemption of Annex 7, lead in high melting temperature solders.
At the engineering and even the procurement level, does this information
need to flow through the supply chain? We all know that an engineer
during the design cycle needs the ability to design in part that is RoHS
compliant. (e.g. part number, abc123, from XYZ Semiconductor is RoHS
Compliant)
However, does there need to be an additional level of detail that
exhibits a part as RoHS Compliant by Exemption? (e.g. part number,
abc123, from XYZ Semiconductor is RoHS Compliant by Exemption)
Finally, does there need to be further level of detail on the actually
exemption? (e.g. part number, abc123, from XYZ Semiconductor is RoHS
Compliant by Exemption per Annex 7)
Regards,
Roland X. DuCote
Arrow Electronics, Inc.
TEL: 303-645-8832
CELL: 720-201-9515
[log in to unmask]
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