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Date: | Wed, 23 Mar 2005 16:25:57 -0500 |
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Believe this is an issue with the immersion gold bath - there if
probably just extraneous AU without a NI underplate?
Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302
Voice: 802.257.4571.21 Fax: 802.257.0011
http://www.vtcircuits.com
-----Original Message-----
From: Colin McVean [mailto:[log in to unmask]]
Sent: Wednesday, March 23, 2005 3:27 PM
To: [log in to unmask]
Subject: [TN] Nickel Gold "step" plating
Hi to all,
We've just completed a batch of Polyimide multilayer PCB's and Ni/Au'd
as our solderable finish.
We have noticed that the Ni/Au has plated onto and around the pads, and
joined up some quad pack pads.
I seem to recall something about Zinc Octanoate acid leaching out from
the surface of the Polyimide, which acts as a catalyst for the solution
to get a grip and plate onto what is bare substrate, or have I got the
wrong end of a long stick?
Would a UV bump lock the substrate surface prior to the finish, or are
there other remedies? (we already IR bake resist at upto 150oC prior to
the application of Ni/Au)
Colin McVean
Production Manager
Artetch Circuits Limited
Tel: 01903 725365
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