I have been asked a question that I've never read anything about before, so
I'm hoping some of you assembly gurus out there will know this...
We have a mechanical engineer who is trying to predict the distance between
boards after soldering SMT board-to-board connectors. We know the connector
mating height, but the question is:
"If the connector is sitting in solder-paste, how high will it stay above
the surface of the board?"
Common sense tells me the connector will not be flush to the surface, there
will be some solder under there, and I think we are using 6mil paste
screens. Has anyone had to document something like this before?
Jack
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