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February 2005

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Subject:
Hot air leveing for SMD - specification
From:
Murulidhara <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Murulidhara <[log in to unmask]>
Date:
Sat, 5 Feb 2005 13:40:37 +0530
Content-Type:
text/plain
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text/plain (28 lines) 
Dear Technetters,


I want to know wheteher there is any specification for hot air leveling operation for PCBs with SMD?


What is the level difference allowed from pad to pad and what is the level difference allowed within a pad?


Thanks in advance.


Regards,


Murulidhara.S


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