In a message dated 2/1/2005 9:35:26 AM Eastern Standard Time,
[log in to unmask] writes:

Last  year we tried to plate copper through holes on LCP.   Blistered
everywhere, top surface, in holes.


LCP is interesting resin.  To plate electroless copper  with adhesion, it
needs a special adhesion promotion treatment - a lot different  from epoxy glass.
I agree, if you just run it down a regular electroless copper  line, you will
get the worst hole wall pull away you have ever seen.

Contact me off line for a copy of the cycle that MacDermid  recommends for
plating the shielding on LCP connector bodies.  The same  cycle works on LCP
core laminate, and I think would work on molded interconnect  devices.

Denny Fritz
MacDermid

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