We have chosen immersion gold as our finish of choice (high volume disk
drive manufacturer) and have seen no cost impact. We use osp only if we
have to (flip chip on flex). While immersion tin and silver may be
improving, we were not happy with the shelf life/discoloration issues we
encountered in past years. Gold works, same costs in volume - don't fix it.
Sincerely,
-----------------------------------
Cheryl Johnson, C.I.D.+
Manager
ExcelStor US Office, Engineering Services
Email: [log in to unmask]
Tel: (303) 684-7291
Fax: (303) 684-7268
Mobile: (303) 809-5815
-----------------------------------
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Johnson, Joseph
Sent: Friday, February 04, 2005 11:08 AM
To: [log in to unmask]
Subject: Re: [TN] OSP process for PCB
David,
There is a lot of people out here that can tell you a lot more about
OSP's but the thing that is at the forefront of my thinking is that a board
with a OSP coating has a short shelf life (6 months or less before it is
assembled) and you have to watch how it get's to you. At a previous place
of employment we had boards coming to us literally on a slow boat from
China. The shipping environment was a large concern and took 1 month to get
them.
Immersion Tin is the choice that is becoming more of a standard for
high volume production. I know there are certain PCB houses that say gold
immersion is as cheap as even a HASL board, but I don't think you would find
it that way for large production runs.
I have no idea how immersion tin effects RF designs.
Hope this helps.
Joe J.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Harman
Sent: Friday, February 04, 2005 12:17 PM
To: [log in to unmask]
Subject: [TN] OSP process for PCB
Can anyone help me understand the difference between gold immersion and the
new technologies (OSP) ORGANIC SOLDERABILITY PRESERVATION, my understanding
is OSP, immersion silver and immersion tin are the leading lead-free
alternatives.
My vendor is asking us to change from a gold immersion to this OSP process.
What are the positives and or negatives for this process? What do I need to
look for? Are there any limitations that may affect RF performance? Is this
process better then gold immersion and if so why?
Comparing OSP to immersion silver or immersion tin, Is this the direction of
the industry? What about reliability?
Any assistance in this would be helpful.
Thanks
David
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