Can anyone help me understand the difference between gold immersion and
the new technologies (OSP) ORGANIC SOLDERABILITY PRESERVATION,  my
understanding is OSP, immersion silver and immersion tin are the leading
lead-free alternatives.  

 My vendor is asking us to change from a gold immersion to this OSP
process. What are the positives and or negatives for this process? What
do I need to look for? Are there any limitations that may affect RF
performance?  Is this process better then gold immersion and if so why?
Comparing OSP to immersion silver or immersion tin, Is this the
direction of the industry? What about reliability?  

 

Any assistance in this would be helpful.

 

Thanks

David

 


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