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February 2005

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Subject:
Re: So what about Tin Whiskers?
From:
"Ingemar Hernefjord (KC/EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ingemar Hernefjord (KC/EMW)
Date:
Fri, 4 Feb 2005 08:10:03 +0100
Content-Type:
text/plain
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text/plain (48 lines) 
you know already, don't you?
Ingemar Hernefjord
Ericsson Microwave Systems


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Kasprzak, Bill (sys)
USX
Sent: den 3 februari 2005 15:28
To: [log in to unmask]
Subject: [TN] So what about Tin Whiskers?


I've been watching the lead free drive move forward for a number of years
now.

So, I have to ask the lead-free pundits, what concerns should I have with
respect to tin whisker growth on SOIC's and other multi-leaded devices where
the lead finish is pure tin?

I know that at the solder joint area, there will not be any concerns about
tin whiskers, but what about between adjacent leads that are not soldered?

Any comments would be appreciated and welcomed.

Bill Kasprzak
Moog Inc., Systems Group, Process Engineer

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