Wednesday, February 9, 2005
10:00 am - 11:00 am (Central Standard Time)
11:00 am - 12:00 pm (East Coast)

$75 IPC member
$125 non-member

What's in store for the designer, board fabricator, assembler and test technologist? These are the questions on everyone's mind as they determine their strategy for the next level of complexity which includes new materials for European legislation component technology, and miniaturization. At one time high reliability and quality were the drivers; today, these requirements are expected as a best practice initiative. So what does the future hold? 

Handheld communication products require miniaturization, high frequency/high speed materials and increased silicon integration for better performance and or product feature capabilities. Those who design standard electronic equipment where size is not an issue will also be faced with managing their product mix using new technology. 

A small group of experts, identified as the Jisso International Council (JIC) has taken on the challenge to define the characteristics of the future electronic products. It is also fostering the development of global standards to address requirements. The JIC members do not write standards, yet their members represent standard developing organizations in Europe, North America, and Asia. The name Jisso is a Japanese word defining the "Total Packaging Solution." As such, the JIC covers design of bare die, component packaging, electronic modules, assembly and system integration. 

The webcast will explore the vision seen by the JIC and other experts from around the world. The information provided will include the technology roadmap descriptions that have been published by SEMI, IPC, NEMI, and Jisso Japan. The roadmaps address the future technology capabilities and needs for semiconductors, printed boards and assemblies. OEMs cost expectations for some of the high technology, high performance requirements will also be covered. Some requirements will not be easy to meet; however, the vision is clear. It is incumbent upon the participants in the electronics equipment supply chain to react and be prepared. 

The webcast will begin at 10:00 a.m. (Central Time) and conclude by 11:00 a.m. To register go to http://www.ipc.org/calendar/Tech4FutureWebcast_305/documents/Tech4Future_Reg.pdf and return it to IPC's registration department via fax at 847-615-7105. 

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