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February 2005

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Subject:
From:
Richard Kraszewski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Richard Kraszewski <[log in to unmask]>
Date:
Wed, 2 Feb 2005 13:56:23 -0500
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text/plain (109 lines)
Set to run at 120 to -45 degC in 90 seconds (air temp). 

Rate of change therefore was ~1.8 deg C/ second . 

Rich K KEDS

 
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brooks,Bill
Sent: Wednesday, February 02, 2005 12:26 PM
To: [log in to unmask]
Subject: Re: [TN] Behavior of Via's in low temperature cycling


What was the rate of change in temperature if you don't mind my asking?


Bill Brooks - KG6VVP
PCB Design Engineer , C.I.D.+, C.I.I.
Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510 e-mail:[log in to unmask]
http://www.dtwc.com http://pcbwizards.com

-----Original Message-----
From: Richard Kraszewski [mailto:[log in to unmask]]
Sent: Wednesday, February 02, 2005 9:12 AM
To: [log in to unmask]
Subject: Re: [TN] Behavior of Via's in low temperature cycling

The material has a high Tg I believe in the 180 range and we had barrel
cracks but no cracks in the layers.  The laminate material is a Polyclad
370turbo with a 2 ply core 8 mils thick with 6 layers. We cycled at 120
to -45degC . Failures were observed round 300 cycles of 125C to -40C.

Thanks for the interest in my situation.

Rich K/  KEDS



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Susan Mansilla
Sent: Wednesday, February 02, 2005 7:42 AM
To: [log in to unmask]
Subject: Re: [TN] Behavior of Via's in low temperature cycling


The test you describe is not a difficult test for today's product to
meet - do you know what type of failure you have?  Corner cracks, barrel
cracks, inner layer separation?????

The Z-axis expansion of the laminate puts stresses on the laminate
system and the plating system.

Do you know what materials went into building the board (Tg etc)?

Susan Mansilla
Robisan Lab

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