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February 2005

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Subject:
From:
Colin McVean <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Colin McVean <[log in to unmask]>
Date:
Wed, 2 Feb 2005 17:21:39 -0000
Content-Type:
text/plain
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text/plain (86 lines)
You may want to try the PCL370 HR product, which is more robust. Also
check degree of cure on the Turbo just to make sure. Call the Tech
Service guys, for help on the press cycle, and they'll check the sample
for you

Colin McVean
Production Manager
Artetch Circuits Limited
Tel: 01903 725365

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Kraszewski
Sent: 02 February 2005 17:12
To: [log in to unmask]
Subject: Re: [TN] Behavior of Via's in low temperature cycling

The material has a high Tg I believe in the 180 range and we had barrel
cracks but no cracks in the layers.  The laminate material is a Polyclad
370turbo with a 2 ply core 8 mils thick with 6 layers. We cycled at 120
to -45degC . Failures were observed round 300 cycles of 125C to -40C. 

Thanks for the interest in my situation.

Rich K/  KEDS

 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Susan Mansilla
Sent: Wednesday, February 02, 2005 7:42 AM
To: [log in to unmask]
Subject: Re: [TN] Behavior of Via's in low temperature cycling


The test you describe is not a difficult test for today's product to
meet - do you know what type of failure you have?  Corner cracks, barrel
cracks, inner layer separation?????

The Z-axis expansion of the laminate puts stresses on the laminate
system and the plating system.

Do you know what materials went into building the board (Tg etc)?

Susan Mansilla
Robisan Lab

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