Hello all

We see the following issue on an ENIG coated PCB (soldered with SnPb):
After reflow solder joint is ok but cross section shows a quite irregular
IMC phase (about 3 mikrometer thick, not homogenous, looks more like stones
on a plane)
After the following wave process (component is on the top side) solder joint
is very fragile and in the cross section some fractures are seen.
Has somebody any picture how a perfect IMC on ENIG should look like? I would
expect a homogeous layer just a few nm thick.

Any ideas?

Siggi

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