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February 2005

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Subject:
From:
"Ingemar Hernefjord (KC/EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ingemar Hernefjord (KC/EMW)
Date:
Wed, 2 Feb 2005 09:01:36 +0100
Content-Type:
text/plain
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text/plain (67 lines)
You are OK, relaxed and fine, Steve?
Enjoying life and planning the future?
Good.
How's the chat with Paul? He seems to be quite invisible at the moment.
Adding pic for your souvenir boutique.
Have a nice day..
Inge



-----Original Message-----
From: Ingemar Hernefjord (KC/EMW)
Sent: den 2 februari 2005 08:57
To: 'TechNet E-Mail Forum'; 'Zweigart, Siegmund'
Subject: RE: [TN] ENIG - Failures


Interesting. Why just few nanometers? We found that 0.5 to 1.5 um seemed to be quite normal.
I'll ask Mountain Jack to hang a skin on the wall. Not perfect a pic, but quite readable. In
this case, Xilinx helped me, their specialists are VERY skilled.
Ingemar Hernefjord
Ericsson Microwave Systems
PS. Steve, ready?

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Zweigart, Siegmund
Sent: den 1 februari 2005 15:12
To: [log in to unmask]
Subject: [TN] ENIG - Failures


Hello all

We see the following issue on an ENIG coated PCB (soldered with SnPb):
After reflow solder joint is ok but cross section shows a quite irregular
IMC phase (about 3 mikrometer thick, not homogenous, looks more like stones
on a plane)
After the following wave process (component is on the top side) solder joint
is very fragile and in the cross section some fractures are seen.
Has somebody any picture how a perfect IMC on ENIG should look like? I would
expect a homogeous layer just a few nm thick.

Any ideas?

Siggi

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