TECHNET Archives

February 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jeffrey Bush <[log in to unmask]>
Date:
Fri, 25 Feb 2005 15:10:51 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (82 lines)
Impedance models good to what I have.  Are you looking for these values
or do you want 50 OHM - the build could be more robust at 50 OHM MS/DSL.
The overall cost of the build could be lower and the composite thickness
less.

Please contact me offline if you would like a proposed build.


Jeffrey Bush
Director, Quality Assurance and Technical Support

VERMONT CIRCUITS INCORPORATED
  76 Technology Drive - POB 1890
    Brattleboro, Vermont 05302
      Voice: 802.257.4571.21 Fax: 802.257.0011
           http://www.vtcircuits.com
 

-----Original Message-----
From: Stephen Gregory [mailto:[log in to unmask]] 
Sent: Friday, February 25, 2005 1:54 PM
To: [log in to unmask]
Subject: [TN] Manufacturability of PCB Stack-up...

Happy Friday All!

I've posted a drawing of a PCB layer stack-up at:

http://www.stevezeva.homestead.com/files/Stackup.jpg

I'd like to verify its manufacturability.  The reason for the
verification
is that there
are dielectric thicknesses that vary quite a bit from layer to layer.

Can anybody comment on this?

Kind regards,

-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
__________________________________________________________________
This message may contain information that is privileged and confidential
to
LaBarge, Inc.  It is for use only by the individual or entity named
above.
If you are not the intended recipient, you may not copy, use or deliver
this message to anyone.  In such event, you should destroy the message
and
kindly notify the sender by reply e-mail.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2