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February 2005

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Subject:
From:
Stephen Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 25 Feb 2005 13:18:19 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (124 lines)
Actually, I don't know enough about the actual fabrication process to have
any...it was our customer who had the question.

I guess they were worried (as I said in my earlier post) about the varying
dielectric thicknesses posing some sort of difficulty...you just use
different
prepreg thicknesses to laminate it all up, right?

Copper all seems pretty balanced to me, so no warping issues should
occur...

Me not being a true-blue board guy, I thought this would be a good Technet
question...

Kind regards,

-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX


|---------+----------------------------->
|         |           "Franklin D       |
|         |           Asbell"           |
|         |           <fasbell@networkci|
|         |           rcuits.com>       |
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|         |           02/25/2005 01:05  |
|         |           PM                |
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  |       To:       "'TechNet E-Mail Forum'" <[log in to unmask]>, <[log in to unmask]>                    |
  |       cc:                                                                                                    |
  |       Subject:  RE: [TN] Manufacturability of PCB Stack-up...                                                |
  >--------------------------------------------------------------------------------------------------------------|




Steve,

That doesn't look difficult at all...what are your concerns???

Franklin D Asbell
Network Circuits, Inc.
Irving, Texas 75061
972-313-1400



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stephen Gregory
Sent: Friday, February 25, 2005 12:54 PM
To: [log in to unmask]
Subject: [TN] Manufacturability of PCB Stack-up...

Happy Friday All!

I've posted a drawing of a PCB layer stack-up at:

http://www.stevezeva.homestead.com/files/Stackup.jpg

I'd like to verify its manufacturability.  The reason for the verification
is that there
are dielectric thicknesses that vary quite a bit from layer to layer.

Can anybody comment on this?

Kind regards,

-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
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__________________________________________________________________
This message may contain information that is privileged and confidential to
LaBarge, Inc.  It is for use only by the individual or entity named above.
If you are not the intended recipient, you may not copy, use or deliver
this message to anyone.  In such event, you should destroy the message and
kindly notify the sender by reply e-mail.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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