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February 2005

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jeffrey Bush <[log in to unmask]>
Date:
Fri, 25 Feb 2005 07:49:07 -0500
Content-Type:
text/plain
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text/plain (75 lines)
We use a .010" stencil - we began with a .005" which had difficulties
peeling mask at that thickness.  The thinner material also cured more
readily during heat cycles which also make the material more difficult
to remove.  The .010" thickness was easy to remove and remained flexible
allowing the entire mass to be peeled rather than breaking off into
smaller sections.  I would test some thickness determine the optimal
range for your material and process.

Jeffrey Bush
Director, Quality Assurance and Technical Support

VERMONT CIRCUITS INCORPORATED
  76 Technology Drive - POB 1890
    Brattleboro, Vermont 05302
      Voice: 802.257.4571.21 Fax: 802.257.0011
           http://www.vtcircuits.com
 
-----Original Message-----
From: Colin McVean [mailto:[log in to unmask]] 
Sent: Friday, February 25, 2005 5:04 AM
To: [log in to unmask]
Subject: [TN] Peelable mask

Good morning!

 

My question to you all on this bright but chilly Friday morning (in the
UK at least) is what you would expect to see as a typical printed and
cured thickness of peelable solder mask applied to a bare board? We
currently apply to PWB's on a screen bed with a stencil applied to a
screen. Stencil thickness can be varied dependant on supplier/type used.

The mask would then be peeled and removed after assembly.

 

Colin McVean

Production Manager

Artetch Circuits Limited

Tel: 01903 725365

 


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