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Date: | Tue, 1 Feb 2005 21:41:14 -0500 |
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Rich,
See IPC-6012 3.11.8
Regards,
George
George M. Wenger, Andrew Corporation
Reliability / FMA Engineer
Base Station & Subsystems Group
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Kraszewski
Sent: Tuesday, February 01, 2005 3:05 PM
To: [log in to unmask]
Subject: [TN] Behavior of Via's in low temperature cycling
I have a 6 layer board with a 10-mil standard through hole (not micro)
via.
Trying to understand what type of stresses 7 factors would drive
failure of this via at cycling from -40degC to 125degC with normal FR4.
Any thoughts or sources of references would be appreciated.
Thanks.
Rich K / KEDS
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