Hi Genny

No this is not the case.  Do you have any other ideas or have seen other
things that may have caused this.  Please advise.
(Embedded image moved to file: pic15890.pcx)




                      Genny Gibbard
                      <Genny.Gibbard@VC        To:       [log in to unmask]
                      OM.COM>                  cc:
                      Sent by: TechNet         Subject:  Re: [TN] SC79 packaging
                      <[log in to unmask]>


                      02/18/2005 12:18
                      PM
                      Please respond to
                      TechNet E-Mail
                      Forum; Please
                      respond to Genny
                      Gibbard





I have definitely seen better responses out of SOT86 and SOT89 pkgs when
the
ground leads are resoldered in RF applications, but then often the layout
tends to have ground vias very close that may rob solder volume.  I don't
know if this applies in the SC79 situation or not.

-----Original Message-----
From: Karen Walters [mailto:[log in to unmask]]
Sent: February 18, 2005 11:00 AM
To: [log in to unmask]
Subject: Re: [TN] SC79 packaging


I would like to add a side note.  Parts on board when soldered do meet
IPC-610 criteria.

                      Karen Walters


Question:   Customer is stating they get better yield at test when the
solder extends to almost the body package of a SC79 package.  As the part
is designed this would not have any impact on part performance.  What I
believe is happening is when they resolder the part lead is making better
contact with the pad.

Have any of you had an issue with this package type that you had better
output responses when you added more solder/ reheated it up so that you can
get better output.  What did you do to improve the situation.  I believe it
is a solder reflow issue in the furnace while cooling.  Please advise.

Thanks

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