Question:   Customer is stating they get better yield at test when the
solder extends to almost the body package of a SC79 package.  As the part
is designed this would not have any impact on part performance.  What I
believe is happening is when they resolder the part lead is making better
contact with the pad.

Have any of you had an issue with this package type that you had better
output responses when you added more solder/ reheated it up so that you can
get better output.  What did you do to improve the situation.  I believe it
is a solder reflow issue in the furnace while cooling.  Please advise.

Thanks

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