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February 2005

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Subject:
From:
"Janoch Jiří, Ing." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Janoch Jiří, Ing.
Date:
Thu, 17 Feb 2005 13:23:07 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines)
Hello Techneters,
could anyone solve this problem, please ? We solder PCB assembly in the
reflow oven. PCBs have ENIG surface contact pads including solder pads.
After reflow,  soldering is perfect, but random fade Sn spots are on the
gold contacts. Is this phenomenon usual for reflow soldering and how to
avoid this
Sn sputtering ?


Many Thanks

J.Janoch, TSE



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