Thank you for the reply Joe,
have you any info on how long boards have been on the shelf & still soldered fine?
Have they been OK for 2nd/3rd stage & rework at all?
Cheers,
Matthew Lamkin.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Johnson, Joseph
Sent: Tuesday, February 15, 2005 3:58 PM
To: [log in to unmask]
Subject: Re: [TN] OSP process for PCB
Lead Free HASL!!!???? Do you have a vendor that will do this!? If so what
is it really called.
Anyway....
We have went to Immersion Tin on all our boards. 1 Year ago this was a
large cost adder to the board because the circuit board vendors only did
Immersion Tin on Thursdays. Now they have so much volume of it they are
able to keep the line running constantly. The price has also come back down
to just about what a HASL board was.
Since you are not supposed to use OSP's (I assume because of shelf life and
other issues with OSP's) the only logical choice is Immersion Tin at this
point in time. There are a few others like flash gold and some others but
the general population I believe is leaning toward Tin....
We also like it because it is very flat and if you have fine pitch parts it
is almost needed in production.
Joe J.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Pete Lymn
Sent: Tuesday, February 15, 2005 10:40 AM
To: [log in to unmask]
Subject: Re: [TN] OSP process for PCB
Have you considered lead free hasl?
-----Original Message-----
From: Matthew Lamkin [mailto:[log in to unmask]]
Sent: Tuesday, February 15, 2005 2:57 PM
To: [log in to unmask]
Subject: Re: [TN] OSP process for PCB
Special applications such as?
I have the task of coming up with the lead free finishes that we are going
to use. OSP will NOT be one of them (I have been told not to use it).
Changing to lead free has removed a few PCB suppliers from our lists.
Thank you,
Matthew Lamkin.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of George Milad
Sent: Tuesday, February 15, 2005 2:48 PM
To: [log in to unmask]
Subject: Re: [TN] OSP process for PCB
Immersion Tin is in use as a surface finish for specific applicatios, it is
not classified as an OSP (organic solderability preservative). Some common
OSPs are Benzotriazoles, Immidazoles and Benzimidazoles. they are non
metallic, organic compounds. Hope this is helpful.
Best regards
George Milad
[log in to unmask]
National Accounts Manager for Technology Uyemura International Corporation
Technical Center 240 Town LIne Rd Southington CT 06489
(516) 901 3874 (mobile)
(860) 793-4011 (office)
(860) 793-4020 (fax)
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
unsubscribe, send a message to [log in to unmask] with following text in the
BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet
NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send
e-mail to [log in to unmask]: SET Technet Digest Search the archives of
previous posts at: http://listserv.ipc.org/archives Please visit IPC web
site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
unsubscribe, send a message to [log in to unmask] with following text in the
BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet
NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send
e-mail to [log in to unmask]: SET Technet Digest Search the archives of
previous posts at: http://listserv.ipc.org/archives Please visit IPC web
site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
unsubscribe, send a message to [log in to unmask] with following text in the
BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet
NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send
e-mail to [log in to unmask]: SET Technet Digest Search the archives of
previous posts at: http://listserv.ipc.org/archives Please visit IPC web
site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
