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| Date: | Tue, 15 Feb 2005 16:33:51 +0100 |
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<http://www.intellectuk.org/sectors/components_and_manufacturing/environmental/alternative_surface_finishes.pdf>
Gebhard
_______________________________
Delphi Deutschland GmbH
Body Security & Mechatronics
Manufacturing Engineering Design
Albert Einstein Straße 5
D-51674 Wiehl-Bomig
Tel.: +49 (0)2261-971-880
Fax: +49 (0)2261-972-880
Mobile: +49 (0)151-18223504
E-mail: [log in to unmask]
-----Ursprüngliche Nachricht-----
Von: TechNet [mailto:[log in to unmask]] Im Auftrag von Matthew Lamkin
Gesendet: Dienstag, 15. Februar 2005 15:57
An: [log in to unmask]
Betreff: Re: [TN] OSP process for PCB
Special applications such as?
I have the task of coming up with the lead free finishes that we are going to use.
OSP will NOT be one of them (I have been told not to use it).
Changing to lead free has removed a few PCB suppliers from our lists.
Thank you,
Matthew Lamkin.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of George Milad
Sent: Tuesday, February 15, 2005 2:48 PM
To: [log in to unmask]
Subject: Re: [TN] OSP process for PCB
Immersion Tin is in use as a surface finish for specific applicatios, it is
not classified as an OSP (organic solderability preservative).
Some common OSPs are Benzotriazoles, Immidazoles and Benzimidazoles. they
are non metallic, organic compounds.
Hope this is helpful.
Best regards
George Milad
[log in to unmask]
National Accounts Manager for Technology
Uyemura International Corporation
Technical Center
240 Town LIne Rd
Southington CT 06489
(516) 901 3874 (mobile)
(860) 793-4011 (office)
(860) 793-4020 (fax)
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