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February 2005

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Subject:
Re: OSP process for PCB
From:
Matthew Lamkin <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Matthew Lamkin <[log in to unmask]>
Date:
Tue, 15 Feb 2005 14:57:14 -0000
Content-Type:
text/plain
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text/plain (59 lines) 
Special applications such as?

I have the task of coming up with the lead free finishes that we are going to use.
OSP will NOT be one of them (I have been told not to use it).

Changing to lead free has removed a few PCB suppliers from our lists.

Thank you,
Matthew Lamkin.



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of George Milad
Sent: Tuesday, February 15, 2005 2:48 PM
To: [log in to unmask]
Subject: Re: [TN] OSP process for PCB


Immersion Tin is in use as a surface finish for specific applicatios, it is
not classified as an OSP (organic solderability preservative).
Some common OSPs are Benzotriazoles, Immidazoles and Benzimidazoles. they
are non metallic, organic compounds.
Hope this is helpful.

Best  regards

George Milad
[log in to unmask]
National Accounts Manager  for Technology
Uyemura International Corporation
Technical Center
240  Town LIne Rd
Southington CT 06489
(516) 901 3874 (mobile)
(860)  793-4011 (office)
(860) 793-4020  (fax)


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