Eric,
Solder joint inspection-by X-ray.
Solder paste deposition MUST be inspected-height is crucial, stencil opening
and pad geometry.look at:
http://www.amkor.com/products/notes_papers/appnotes_LGA_0902.pdf

http://www.eettaiwan.com/ARTICLES/2001JUN/2001JUN07_SMT_DH_AN1928.PDF

Gaby
----- Original Message -----
From: "Eric CHRISTISON" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, February 14, 2005 4:39 PM
Subject: Re: [TN] LGA Packages


> Thanks Joyce,
>
> I would have thought them to have worse fatigue characteristics than BGA
> plus I'd expect them to be difficult to inspect and impossible to rework
but
> I'm often wrong...
>
>
> Eric  Christison
> Mechanical Engineer
> Consumer & Micro Group - Imaging Division
> STMicroelectronics
> 33 Pinkhill
> Edinburgh
> EH12 7BF
>
> Tel:     +44 (0)131 336 6165
> Fax:    +44 (0)131 336 6001
>
>
> > -----Original Message-----
> > From: Joyce Koo [mailto:[log in to unmask]]
> > Sent: Monday, February 14, 2005 2:16 PM
> > To: TechNet E-Mail Forum; Eric CHRISTISON
> > Subject: RE: [TN] LGA Packages
> >
> >
> > better fatique characteristics... it depends..(Introduction
> > to Doug Paul...).
> >                               jk
> >
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]]On Behalf Of Eric CHRISTISON
> > Sent: Monday, February 14, 2005 6:07 AM
> > To: [log in to unmask]
> > Subject: [TN] LGA Packages
> >
> >
> > Does anyone have any experience of such a package type.
> >
> > If so what are they? Good, bad or indifferent?
> >
> > Thanks,
> >
> >
> > Eric  Christison
> > Mechanical Engineer
> > Consumer & Micro Group - Imaging Division
> > STMicroelectronics
> > 33 Pinkhill
> > Edinburgh
> > EH12 7BF
> >
> > Tel:     +44 (0)131 336 6165
> > Fax:    +44 (0)131 336 6001
> >
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