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February 2005

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Subject:
From:
Eric CHRISTISON <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Eric CHRISTISON <[log in to unmask]>
Date:
Mon, 14 Feb 2005 14:39:11 -0000
Content-Type:
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Thanks Joyce,

I would have thought them to have worse fatigue characteristics than BGA
plus I'd expect them to be difficult to inspect and impossible to rework but
I'm often wrong...


Eric  Christison
Mechanical Engineer
Consumer & Micro Group - Imaging Division
STMicroelectronics
33 Pinkhill
Edinburgh
EH12 7BF

Tel:     +44 (0)131 336 6165
Fax:    +44 (0)131 336 6001


> -----Original Message-----
> From: Joyce Koo [mailto:[log in to unmask]] 
> Sent: Monday, February 14, 2005 2:16 PM
> To: TechNet E-Mail Forum; Eric CHRISTISON
> Subject: RE: [TN] LGA Packages
> 
> 
> better fatique characteristics... it depends..(Introduction 
> to Doug Paul...).
>                               jk
> 
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Eric CHRISTISON
> Sent: Monday, February 14, 2005 6:07 AM
> To: [log in to unmask]
> Subject: [TN] LGA Packages
> 
> 
> Does anyone have any experience of such a package type.
> 
> If so what are they? Good, bad or indifferent?
> 
> Thanks,
> 
> 
> Eric  Christison
> Mechanical Engineer
> Consumer & Micro Group - Imaging Division
> STMicroelectronics
> 33 Pinkhill
> Edinburgh
> EH12 7BF
> 
> Tel:     +44 (0)131 336 6165
> Fax:    +44 (0)131 336 6001
> 
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