Hi All,

Got a question on the reliability of Sn/Pb solder
joint interface.

If you have a lead-free BGA and you reflow
it onto the board using Sn63/Pb37 paste, but the
reflow temperature is below the melting temperature
(assuming a profile for regular sn/pb solder)of
the Lead-free solder. Will the solder joint interface
between the sn/pb and the lead-free ball be reliable?
Are there any reliablility data available?

Thanks all in advance.

Regards,

Ted Kong




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