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February 2005

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Subject:
Mixing Lead free BGAs with normal BGAs
From:
DUTTON Phil <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, DUTTON Phil <[log in to unmask]>
Date:
Fri, 11 Feb 2005 15:17:52 +1100
Content-Type:
text/plain
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text/plain (25 lines) 
Hello,

We've run into a problem where a PB Assembly will have a mixture of
BGAs, some with regular tin/lead solder balls, some with lead free
solder balls.
This raises the question as to what temperature profile to run. Do we
need to ask our loader to do a Pb free profile first, followed by a Pb
profile? Or will it be ok to solder both together using the regular,
lower temperature Pb profile?
Personally I'd like to avoid the extra run through reflow.

thanks,

Phil Dutton C.I.D.

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