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Subject:	When to glue
From:	"Black, Paul" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Black, Paul
Date:	Thu, 10 Feb 2005 16:47:45 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (19 lines)

Hi TechNetters,

I know that this has been discussed on the forum before, but I can't find it in the archives. I have a component (inductor) that is falling off in the oven once the board has been flipped over to process the other side. Although I believe that the main issue is the undersized footprint, it is a fairly heavy part. Does anyone recall the weight/size rule that is used to calculate when you should glue a part down?

Thank you, 
Paul Black 
Manufacturing Engineer 
Kronos 

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