TECHNET Archives

February 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Leo Higgins <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Leo Higgins <[log in to unmask]>
Date:
Tue, 1 Feb 2005 11:22:59 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (88 lines)
While I was with Siemens, the group developing an injection molded LCP
package (Polymer Stud Grid Array) had perfected a process for direct plating
on filled LCP (surface and 0.100mm microvias through 0.350mm thick LCP over
5 years ago.  Surface metal adhesion was equal to or better than Cu adhesion
to dielectric in HDI build-up substrates.  Highly adherent surface
conductors as fine as 0.050mm lines and spaces were processed non
photolithographically using laser structuring of an immersion Sn layer which
was used as an in-situ mask for ammoniacal Cu etching.  The process die
require proprietary processing to make the Cu adhere directly to the LCP.
Plating was blister free.


Best regards,
Leo

Director of Applications Engineering
ASAT, Inc.
3755 Capital of Texas Highway, Suite 100
Austin, Texas     78704

ph     512-383-4593
fx      512-383-1590
[log in to unmask]
www.asat.com


The information contained in this electronic message is CUSTOMER/SUPPLIER
PRIVILEGED AND CONFIDENTIAL INFORMATION intended only for the use of the
individual or entity named above. If the reader of this message is not the
intended recipient, you are hereby notified that any dissemination,
distribution and copying of this communication is strictly prohibited. If
you have received this communication in error, please immediately notify the
sender by electronic mail. Thank you.



-----Original Message-----
From: Dennis Fritz [mailto:[log in to unmask]]
Sent: Tuesday, February 01, 2005 8:57 AM
To: [log in to unmask]
Subject: Re: [TN] Plating on LCP/PPA Moulded devices


In a message dated 2/1/2005 9:35:26 AM Eastern Standard Time,
[log in to unmask] writes:

Last  year we tried to plate copper through holes on LCP.   Blistered
everywhere, top surface, in holes.


LCP is interesting resin.  To plate electroless copper  with adhesion, it
needs a special adhesion promotion treatment - a lot different  from epoxy
glass.
I agree, if you just run it down a regular electroless copper  line, you
will
get the worst hole wall pull away you have ever seen.

Contact me off line for a copy of the cycle that MacDermid  recommends for
plating the shielding on LCP connector bodies.  The same  cycle works on LCP
core laminate, and I think would work on molded interconnect  devices.

Denny Fritz
MacDermid

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2