TECHNET Archives

February 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Leo Higgins <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Leo Higgins <[log in to unmask]>
Date:
Tue, 1 Feb 2005 11:11:49 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (129 lines)
Liquid crystal polymer is being molded onto leadframes by several different
suppliers.  Several IC subcontract assembly companies, as mentioned below,
and including my own, are engaged in qualification work on such packages.
One of the leadframe metallurgies being evaluated is a NiPdAu preplated
leadframes, eliminating need for plating after LCP injection molding or
after package assembly.


Best regards,
Leo

Director of Applications Engineering
ASAT, Inc.
3755 Capital of Texas Highway, Suite 100
Austin, Texas     78704

ph     512-383-4593
fx      512-383-1590
[log in to unmask]
www.asat.com


The information contained in this electronic message is CUSTOMER/SUPPLIER
PRIVILEGED AND CONFIDENTIAL INFORMATION intended only for the use of the
individual or entity named above. If the reader of this message is not the
intended recipient, you are hereby notified that any dissemination,
distribution and copying of this communication is strictly prohibited. If
you have received this communication in error, please immediately notify the
sender by electronic mail. Thank you.



-----Original Message-----
From: David Greig [mailto:[log in to unmask]]
Sent: Monday, January 31, 2005 9:50 AM
To: [log in to unmask]
Subject: Re: [TN] Plating on LCP/PPA Moulded devices


Hi Eric,

Assuming that your meaning QFN/MLF style packages from the likes of
Amkor/Carsem/Chipmos etc the you can get just about any plating. Sn, SnPb,
Ag and Au seems to be on offer, with Sn probably the most common. Seems that
most often the platting is carried out before separating the peripheral
leadframe, so there's a remnant of unplated Cu on the lower side of the lead
edges.

There was a publication recently about LCP packages with embedded solder
balls and internal die to ball wirebonds. Basically 5 sided with the die
facing up and potted with optically transparent resin. Can't quite remember
which publication and when (2004).

Best Regards

David Greig
______________________________
GigaDyne Ltd
Buchan House
Carnegie Campus
Dunfermline KY11 8PL
United Kingdom
t: +44 (0)1383 624 975
http://www.gigadyne.co.uk
______________________________

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eric CHRISTISON
Sent: 31 January 2005 14:15
To: [log in to unmask]
Subject: [TN] Plating on LCP/PPA Moulded devices

I've got an interest in thermoplastic moulded chip packages - I think
they're generally done in LCP or PPA.

Can anyone tell me what plating system is used with them and, even better,
who does it.

Thanks,

Eric  Christison
Mechanical Engineer
Consumer & Micro Group - Imaging Division STMicroelectronics
33 Pinkhill
Edinburgh
EH12 7BF

Tel:     +44 (0)131 336 6165
Fax:    +44 (0)131 336 6001

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
unsubscribe, send a message to [log in to unmask] with following text in the
BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet
NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send
e-mail to [log in to unmask]: SET Technet Digest Search the archives of
previous posts at: http://listserv.ipc.org/archives Please visit IPC web
site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
--
Virus scanned by Lumison.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2