For those of use still running through hole wave solder systems, what
would be the "recommended" RoHS compliant board that might use immersion
tin or ENIG and 2 oz. copper?
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
(AZ75)
Sent: Thursday, February 17, 2005 9:48 AM
To: [log in to unmask]
Subject: Re: [LF] RoHS compliance PCB
Assuming you have met all the other requirements, a minimum Tg of 155 C
and
350 C decomposition temperature should give you a reasonable chance of
meeting your functional, as well as economical goals.
Dewey
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Smith, Rick
Sent: Thursday, February 17, 2005 7:38 AM
To: [log in to unmask]
Subject: Re: [LF] RoHS compliance PCB
Ken,
Check with your process guys. I have found increasing laminate
decomposition temperature to above 330 C is required, and moving to 170
Tg laminate is unnecessary and a cost adder with respect to 4/8 layer
computer boards.
Laminates with Tg 145, 150 survive LF BGA rework provided the
decomposition temperature is >330 C.
Anyone else working on laminates have input?? Please coment.
thanks
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Ken Patel
Sent: Wednesday, February 16, 2005 5:06 PM
To: [log in to unmask]
Subject: [LF] RoHS compliance PCB
All,
I have heard that Fab Houses are moving directly to Halogenfree process,
skipping middle step knowing that Halogenfree is next in line to be
implemented. As our current fabs are built using laminate made of Tg of
170
C or more with Nickel Gold surface finish, do you see any problem?
Do we have to worry besides updating the fab notes asking for RoHS
compliance? We expect fab house to build products based on impedance
requirement. Any comments, suggestion?
Re,
Ken Patel
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