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Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Wed, 16 Feb 2005 21:16:46 EST |
Content-Type: | text/plain |
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Hi Jovan,
Be careful about the conclusions drawn from 'spreading tests'—spreading is
NOT the same as wetting. Paticularly with ENIG, the spreading is facilitated by
the rapid dissolution of the Au into the Sn, but the wetting has to take place
to the Ni, which requires significantly more thermal energy than wetting to
Cu.
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
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