Hi all,
We are PCB manufacturer and we are supplying our boards with several
alternative finishing ( ENIG , OSP , Immersion Tin, Immersion Silver ).
Recently we staret  internal discussions concerning lead-free era.
What about objective solderability tests for bare PCB ???
 It seems to me, that "wetting ballance" test based on using of melted
eutectic Tin-Lead is not relevant anymore because of two reasons :
1. Tin-Lead solder will be excluded and replaced by ???? What kind of solder
will be recognised as "official lead free solder" ??
2. Today's boards ( at least those we are manufacturing ) are mainly all
kinds of SMT, it means using solder pastes and I.R. reflow and not through
hole using solder wave.

Solder Spread Test seems to be more relevant, but what paste should be used
and which parameters ????

Opinions???

Regards
Edward

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