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February 2005

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Subject:
From:
"James, Chris" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 16 Feb 2005 08:58:08 -0000
Content-Type:
text/plain
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text/plain (71 lines)
We discussed this last week. The document where you'll find it is:

com2004_0606en01



But this still has to be confirmed by publication in the OJ.



http://europa.eu.int/eur-lex/en/com/pdf/2004/com2004_0606en01.pdf





Regards,

Chris



-----Original Message-----

From: Leadfree [mailto:[log in to unmask]] On Behalf Of MA/NY DDave

Sent: 16 February 2005 04:05

To: [log in to unmask]

Subject: Re: [LF] maximum concentration 0.1%



Hi Scott, IPC LF Listservers,



If you go back and do a search on IPC LF you will find a good deal of

discussion about this in 2003, 2004. Soldertec, Tin Technology and a few

others had meetings in Japan and developed road maps that started to

define

this .1% by weight. I would guess that these road maps (which was done

very

nicely) might still be available on either the Japaneese site (JEITA) or

Soldertec. Use .1%, and then use 1000ppm, as search terms on LF would be

my

first guess.



From other notes this year you can see that pretty soon we will see

this .1% in an official document rather than guidance documents.



Yours in Engineering, Dave

Y i Engr, MA/NY DDave



P.S If Kay enters this stream you will get even more history.



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