Good morning to all,

Does anyone on the list know what the max. temperature a part is required to meet during the
reflow solder process for lead free.  We are in the process of contacting various suppliers and
asking if there parts are lead free, and process compatible.  It was my understanding that the
parts must be able to withstand 260 C for 20 to 40 seconds to be considered process compatible.
My question arises from the response we are getting back from some suppliers that say they only
have to meet 245 deg C for 20 to 40 seconds, and they reference JEDEC STD-020C.  Has anyone
else run into this?

Thanks for your time

Bob Brown
Square D /Group Schneider
Staff Component Engineer

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