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February 2005

Leadfree@IPC.ORG

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Subject:
From:
MA/NY DDave <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Sun, 13 Feb 2005 21:55:38 -0600
Content-Type:
text/plain
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text/plain (26 lines)
Hi Greg, IPC LF Listservers,

Perhaps you could give the source document.

<I have read proposed changes/addition to the annex of exemptions will
include “Lead in solders to complete a viable electrical connection
between semiconductor die and carrier within integrated circuit Flip
Chip packages”.>
<
<How is this interpreted, is it all solder used for Flip Chip bumps
(including eutectic) and not just high lead bumps?>

If documented I would agree with you. All lead in solder.


Yours in Engineering, Dave
Y i Engr, MA/NY DDave

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