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February 2005

Leadfree@IPC.ORG

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Subject:
From:
"James, Chris" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Mon, 28 Feb 2005 09:39:59 -0000
Content-Type:
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text/plain (73 lines)
We still expect equipment capability to be the limiting factor on board

size.



You may need to look a board supports to stop sag.



There are many projects starting or underway looking into process

concerns, the NPL being one.



Regards,

Chris



-----Original Message-----

From: Leadfree [mailto:[log in to unmask]] On Behalf Of Colin Weber

Sent: 28 February 2005 00:08

To: [log in to unmask]

Subject: [LF] Maximum PWB Size



Hi Folks,



Can anyone suggest what might be a good guide for maximum multilayer

(4-8

layers) PWB size

for Lead Free Processes. ie. Has anyone experienced a PCB size

limitation

where lead free

processing raises concern for reliability of the boards service life?



I am of the understanding that reliability may be poorer for larger

printed

circuit boards

going through the higher temperatures during manufacture. Issues like

warping and plated

through-holes stress being of particular concern to me.







Regards,



Colin Weber



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