Hi Ken,
Unfortunately, the whole halogen-arena and their consequences is not my
specialty. I would suspect they influence fire-retardency aspects more than
anything else.
I am more concerned that PCB materials can take the elevated processing T's
required for LF-solders, and that they do not put excessive stresses on the PCB
interconnect structures. Specifying Tg and Td is going a long way in that
directions, but I would also specify a maximum thermal expansion between 50 and
260C.
I am pushing for a Soldering Temperature Impact Index, STII, to address this:

and I would specify an STII>=215.

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com


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