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Subject:	Re: HVQFN packages
From:	Terence Collier <[log in to unmask]>
Reply To:	(Designers Council Forum)
Date:	Mon, 7 Feb 2005 15:09:58 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (50 lines)

If you could avoid, I'd go with the TSSOP from a reliability standpoint. The
QFN's, in my opinion, are still not there for high rel applications.

They can be placed but if you are not familiar, I recommend some practice on
a dummy board or a solder sample board.

Terence
----- Original Message -----
From: <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, February 07, 2005 1:22 PM
Subject: [DC] HVQFN packages


> Hi All
>
> I have an engineer that is specifting some parts from Philips in a HVQFN,
no lead package. Are there any assembly issues with these packages? Do work
with standard manufacturing processes? If we are not really cramped for real
estate should we use TSSOP?
>
> Thanks
>
>
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> Gary

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