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Date: | Tue, 1 Feb 2005 09:57:29 EST |
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In a message dated 2/1/2005 9:35:26 AM Eastern Standard Time,
[log in to unmask] writes:
Last year we tried to plate copper through holes on LCP. Blistered
everywhere, top surface, in holes.
LCP is interesting resin. To plate electroless copper with adhesion, it
needs a special adhesion promotion treatment - a lot different from epoxy glass.
I agree, if you just run it down a regular electroless copper line, you will
get the worst hole wall pull away you have ever seen.
Contact me off line for a copy of the cycle that MacDermid recommends for
plating the shielding on LCP connector bodies. The same cycle works on LCP
core laminate, and I think would work on molded interconnect devices.
Denny Fritz
MacDermid
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