Subject: | |
From: | |
Reply To: | |
Date: | Sat, 26 Feb 2005 12:05:05 -0800 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
----- Original Message -----
From: "Phil Nutting" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, February 25, 2005 11:05 AM
Subject: [TN] Planar Transformer construction on circuit boards
> This is for the SMT process people. We
> Good Friday Afternoon,
>
> This is for the SMT process people. We are making a surface mount board
> that includes a planar transformer. If I take two sections of board and
> have SMT style pads to mount one board to the other will I experience
> reflow problems because the solder pads will be separated (a gap) by two
> thicknesses of LPI mask?
>
Phil,
Maybe I shouldn't answer since I'm not an SMT process person, but I made
similar boards to adapt a thinner SOIC into a wider SOIC space. I don't
remember if they ever reached the reflow stage (I think they did) but I know
the hand assembled ones worked like a charm. I would think if your boards
were bonded together and maybe edge plated there would be no problem.
Good luck,
Richard
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|