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Thu, 10 Feb 2005 16:47:45 -0500 |
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Hi TechNetters,
I know that this has been discussed on the forum before, but I can't find it in the archives. I have a component (inductor) that is falling off in the oven once the board has been flipped over to process the other side. Although I believe that the main issue is the undersized footprint, it is a fairly heavy part. Does anyone recall the weight/size rule that is used to calculate when you should glue a part down?
Thank you,
Paul Black
Manufacturing Engineer
Kronos
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