Rogers RFlex 3850 is an LCP with an excellent bend radius capability.
The material has a RTI of 240 C, Tensile modulus of 2255 MPa and DWV of
4000 V/mil.
http://www.rogerscorporation.com/acm/about_our_products.htm#3000
Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302
Voice: 802.257.4571.21 Fax: 802.257.0011
http://www.vtcircuits.com
-----Original Message-----
From: Lee Parker [mailto:[log in to unmask]]
Sent: Tuesday, January 11, 2005 6:14 PM
To: [log in to unmask]
Subject: Re: [TN] FW: Flexible vs. rigid substrates
Steve
As you probably noticed in my email, I placed bend-flex in parenthesis
to indicate a generic material not necessarily the brand name. An
example of the material I had in mind is the Rogers 3000 series.
Best regards
Lee
-----Original Message-----
From: Steve Kelly [mailto:[log in to unmask]]
Sent: Tuesday, January 11, 2005 1:56 PM
To: 'TechNet E-Mail Forum'; 'Lee Parker'
Subject: RE: [TN] FW: Flexible vs. rigid substrates
Hi Lee,
As far as I am aware this product was taken off the market by Roger's
2-3
years ago. Regards Steve Kelly
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee Parker
Sent: Tuesday, January 11, 2005 1:37 PM
To: [log in to unmask]
Subject: Re: [TN] FW: Flexible vs. rigid substrates
Mike
There is a material referred to "bend-flex". It is used for static flex
and can be bent 180 degrees. Rogers has such a material.
The angle of the bend is not nearly as important as the radius. This is
discussed on several web pages of material suppliers, in the IPC Flex
Design Guide and in my symposiums on Flex PCs.
Best regards
Lee
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Simms, Michael
Sent: Monday, January 10, 2005 5:50 PM
To: [log in to unmask]
Subject: [TN] FW: Flexible vs. rigid substrates
Hello T'Netters,
In the absence of any replies to a question that I believe many of you
should have knowledge about, please allow me to re-post:
> Recently, the issue of the use of rigid printed wiring boards in an
> application
> which demands that printed wiring boards be pressed into an outer
shell
> with some
curvature has surfaced.
> I'm accustomed to the use of flexible substrates for any applications
> which demand
that the board does not stay flat.
> However, I don't see any IPC document which mandates the use of rigid
> boards
> for 180-degree assembly applications and flex boards (or rigid-flex)
for
> anything else.
>
Should rigid boards be used in applications which demancd that
the assemblies be flexed to some degree?
> Are there any guidelines for the selection of one type over another?
> Are there any reliability issues with the use of surface mount devices
on
> flex boards which don't also apply to rigid boards?
> Why would a manufacturer opt for a rigid board over a flex board for
> assemblies which
> are subsequently flexed? Is this a choice based on cost?
Thanks,
Regards,
Mike
Mike Simms
Chemist
Trace Laboratories - Central
1150 W. Euclid Ave.
Palatine, IL 60067
phone 847-934-5300
fax 847-934-4600
www.tracelabs.com
Notice: This message is confidential and intended for the private use
of
the addressee only.
>
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask]
or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
