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January 2005

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Subject:
From:
"Ingemar Hernefjord (KC/EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ingemar Hernefjord (KC/EMW)
Date:
Tue, 11 Jan 2005 15:39:55 +0100
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text/plain (86 lines)
women....

Ingemar

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]
Sent: den 11 januari 2005 15:25
To: [log in to unmask]
Subject: Re: [TN] Thermal Compound vs. Sil-Pads


you can always use diamond... if you are rich enough...

http://www.aitechnology.com/thermal.html
                              jk

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Eric Kalgren
Sent: Tuesday, January 11, 2005 9:04 AM
To: [log in to unmask]
Subject: [TN] Thermal Compound vs. Sil-Pads


Good morning everyone!  We have an issue that has come up dealing with
sinking heat out of a resistor on one of our antennas.  We are currently
using thermal compound (Wakefield 120) between the resistor and the heat
sink.  However, we are ramping production up to full tilt and we'd like
to use a precut thermal pad (like a sil-pad but a different brand name)
to save some time on assembly.  Have any of you used these in heat
sinking. How do they compare to the goop that is heat sink compound?  It
is a 150W flange mount resistor by Florida RF labs spec'ed for a max
temp of 150*C and a frequency range of DC-2GHz.



Thanks in advance for your help



Eric Kalgren

Manufacturing Engineer

Atlantic Microwave

Phone: 978-779-7062

Fax:     978-779-0101




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