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January 2005

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Subject:
FW: Flexible vs. rigid substrates
From:
"Simms, Michael" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Simms, Michael
Date:
Mon, 10 Jan 2005 16:50:24 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (54 lines) 
Hello T'Netters,
In the absence of any replies to a question that  I believe  many of you
should have knowledge about, please allow me to re-post:

> Recently, the issue of the use of rigid printed wiring boards in an
> application
> which demands that printed wiring boards be pressed into an outer shell
> with some
curvature has surfaced.
> I'm accustomed to the use of flexible substrates for any  applications
> which demand
that the board does not stay flat.
> However, I don't see any IPC document which mandates the use of rigid
> boards
> for 180-degree assembly applications and flex boards (or rigid-flex) for
> anything else.
>
Should rigid boards be used in applications which demancd that
the assemblies be flexed to some degree?
> Are there any guidelines for the selection of one type over another?
> Are there any reliability issues with the use of surface mount devices on
> flex boards which don't also apply to rigid boards?
> Why would a manufacturer opt for a rigid board over a flex board for
> assemblies which
> are subsequently flexed?  Is this a choice based on cost?
Thanks,
Regards,
Mike

Mike Simms
Chemist
Trace Laboratories - Central
1150 W. Euclid Ave.
Palatine, IL  60067

phone  847-934-5300
fax      847-934-4600
www.tracelabs.com

Notice:  This message is confidential and intended for the private use of
the addressee only.

>

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