DC members,

I have encountered a patent which any through-hole land patterns with an
annular ring of >0.4mm and used for lead-free soldering is in violation
of.  We have used 0.4mm as our standard annular ring for all
through-hole devices with  hole sizes greater than 1.6mm for years.  A
link to the patent is provided below.  Are there any IPC documents I can
use to invalidate this patent?  Any suggestions or comments will be
welcomed.

 

http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL
&p=1&u=/netahtml/srchnum.htm&r=1&f=G&l=50&s1=6,617,529.WKU.&OS=PN/6,617,
529&RS=PN/6,617,529

 

Scott Nimon

Yazaki North America

6801 Haggerty Road

Mail Stop:  2229E

Canton, MI 48187

 

Phone:  734-983-2630

Fax:  734-983-2631

[log in to unmask] 

 




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